Surface Mount Technology (SMT) is the dominant method for modern PCB assembly.
The SMT Assembly Process
- Solder Paste Printing — applying paste through a stencil onto PCB pads
- Solder Paste Inspection (SPI) — 3D inspection of paste volume and alignment
- Component Placement — high-speed pick-and-place machines (up to 80,000 CPH)
- Reflow Soldering — controlled heating profile melts solder to form joints
- Automated Optical Inspection (AOI) — visual inspection of every joint
- X-ray Inspection — for BGA and hidden joints
HUAXING operates 9 SMT lines with Siemens/ASM and Yamaha placement systems.
Component Capabilities
- 01005 to 55mm² BGA packages
- Fine-pitch down to 0.3mm
- Double-sided SMT assembly
- Mixed technology (SMT + through-hole)
Get a free DFM review with your quote.